SWaP-C MIN317 Uncooled Thermal Imaging Camera Core 384×288/17μm

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April 29, 2025
Category Connection: LWIR Camera Module
Brief: Discover the SWaP-C MIN317 Uncooled Thermal Imaging Camera Core with 384×288 resolution and 17μm pixel size. Featuring advanced wafer-level-package technology and TEC-less design, it delivers sharp images with low power consumption. Ideal for fast integration and secondary development.
Related Product Features:
  • Utilizes wafer-level-package infrared detector for cost-effective integration.
  • Compact size (25.4×25.4×16.3mm) and lightweight (13.4g).
  • Low power consumption at just 0.8W.
  • Multiple interfaces: USB2.0, DVP, LVDS for easy integration.
  • Supports RAW/YUV image data output and serial port control.
  • High sensitivity with Vanadium Oxide material.
  • Spectral range of 8μm~14μm for accurate thermal imaging.
  • Operates in temperatures from -40℃ to 70℃.
Faqs:
  • What is the resolution of the MIN317 thermal imaging camera core?
    The MIN317 features a resolution of 384×288 with a pixel size of 17μm.
  • What interfaces are available for integration?
    The MIN317 offers USB2.0, DVP, LVDS interfaces, supporting RAW/YUV image data output and serial port control for fast integration.
  • What is the typical power consumption of the MIN317?
    The MIN317 has a typical power consumption of just 0.8W, making it highly energy-efficient.
  • What is the spectral range of the MIN317?
    The MIN317 operates within a spectral range of 8μm to 14μm, ideal for thermal imaging applications.
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