Brief: Discover the SWaP-C MIN317 Uncooled Thermal Imaging Camera Core with 384×288 resolution and 17μm pixel size. Featuring advanced wafer-level-package technology and TEC-less design, it delivers sharp images with low power consumption. Ideal for fast integration and secondary development.
Related Product Features:
Utilizes wafer-level-package infrared detector for cost-effective integration.
Compact size (25.4×25.4×16.3mm) and lightweight (13.4g).
Low power consumption at just 0.8W.
Multiple interfaces: USB2.0, DVP, LVDS for easy integration.
Supports RAW/YUV image data output and serial port control.
High sensitivity with Vanadium Oxide material.
Spectral range of 8μm~14μm for accurate thermal imaging.
Operates in temperatures from -40℃ to 70℃.
Faqs:
What is the resolution of the MIN317 thermal imaging camera core?
The MIN317 features a resolution of 384×288 with a pixel size of 17μm.
What interfaces are available for integration?
The MIN317 offers USB2.0, DVP, LVDS interfaces, supporting RAW/YUV image data output and serial port control for fast integration.
What is the typical power consumption of the MIN317?
The MIN317 has a typical power consumption of just 0.8W, making it highly energy-efficient.
What is the spectral range of the MIN317?
The MIN317 operates within a spectral range of 8μm to 14μm, ideal for thermal imaging applications.